Diamond inlaid composite plating

Tools (such as drills, reamers, abrasive, roller, etc.) of diamond, cubic boron nitride and other superhard materials have been prepared to produce oil, and coal industry exploration and machinery, instruments, electronics and other minerals in the A large number of applications have been obtained in equipment processing. Preparing diamond tools are mainly two kinds of powder metallurgy and composite plating. Compared with the powder metallurgy method, the composite plating method has a simple equipment, can reduce the loss of the mold, does not cause the diamond to be subjected to heat loss, and is easy to repair, and thus has a place in the manufacture of the diamond tool. Depending on the number of layers of diamond particles embedded in the surface of the diamond tool, the manufacturing method can be divided into two types: the table setting method and the gestation method.
The process of the impregnation method is generally as follows: pretreatment - plating of diamond-free matrix metal Ni or Ni-Co) - sand plating - re-plating 3 ~ 5 μm bright nickel - surface finishing.
The specification of electroplated nickel-based diamond inlay plating is as follows: nickel sulfate 220-240g/L, cobalt sulfate 15-30g/L, boric acid 25-35g/L, sodium chloride 10-20g/L, 1,4-butyne II Alcohol 0.6-0.8 g/L, saccharin 0.8-1.0 g/L, sodium lauryl sulfate 0.08-0.1 g/L, diamond (5-7 μm) 5-10 g/L, temperature 45-50 ° C, pH 4.1 to 4.5, current density 2A/dm 2 , strong agitation of air.

Liquid Cooling Plate Heat Sink

Liquid Cooling Plate Heat Sink is a high-performance heat sink that uses liquid cooling technology to dissipate heat generated by electronic devices. It is designed to be used in applications where air cooling is insufficient or impractical. The heat sink is made up of a series of channels that are filled with liquid coolant. The coolant flows through the channels, absorbing heat from the electronic device and carrying it away from the heat sink.The liquid cooling plate heat sink is typically made of materials such as copper or aluminum, which have high thermal conductivity. The channels are designed to maximize the surface area of the heat sink, allowing for efficient heat transfer. The liquid coolant used in the heat sink can be water, glycol, or other specialized fluids that are optimized for heat transfer.One of the main advantages of liquid cooling plate heat sinks is their ability to dissipate large amounts of heat in a small space. This makes them ideal for use in high-power applications such as computer processors, power electronics, and LED lighting. They are also ideal for use in applications where noise and vibration must be minimized, as liquid cooling is much quieter than traditional air cooling methods.
Overall, liquid cooling plate heat sinks are a highly efficient and effective way to dissipate heat in electronic devices. They offer superior performance compared to traditional air cooling methods and are ideal for use in high-power and noise-sensitive applications.

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