The WhereLAN III sensor receives a low-power signal from its active RFID tag, called WhereTags, at a distance of 1,750 meters (5741 feet). It uses advanced signal processing technology to achieve a sub-nanosecond resolution of the arrival time of a WhereTags, which allows the position accuracy to be controlled within 1 meter.
WhereLAN III provides location and tag data to the back-end software system, which calculates the tag's location and provides tools to integrate personnel with customer and third-party application data. The WhereLAN III has an IP 55 cast aluminum housing protection level and can be configured to dynamically adjust the RF environment while maintaining wireless synchronization.
The upgraded sensor includes a software radio digital signal processing and "snapshot" technology that, according to Zebra Technology Introduction, more than doubles the positioning accuracy of previous generation sensors. With optional Wi-Fi and revolutionary wireless synchronization, WhereLAN III excels in both indoor and outdoor applications for wireless devices. The company's design of the WhereLAN III is fully backward compatible with the previous generation of position sensors, allowing users to mix and use several generations of products.
WhereLAN III is now available to markets in the United States, Canada, Europe, Colombia, Egypt, India, Kuwait, Turkey, United Arab Emirates (UAE), Australia, New Zealand, Singapore and Thailand.
Selective Laser Sintering (SLS) was developed at the University of Texas in Austin, by Carl Deckard and colleagues. The technology was patented in 1989 and was originally sold by DTM Corporation. DTM was acquired by 3D Systems in 2001. The basic concept of SLS is similar to that of SLA. It uses a moving laser beam to trace and selectively sinter powdered polymer and/or metal composite materials into successive cross-sections of a three-dimensional part. As in all rapid prototyping processes, the parts are built upon a platform that adjusts in height equal to the thickness of the layer being built. Additional powder is deposited on top of each solidified layer and sintered. This powder is rolled onto the platform from a bin before building the layer. The powder is maintained at an elevated temperature so that it fuses easily upon exposure to the laser. Unlike SLA, special support structures are not required because the excess powder in each layer acts as a support to the part being built. With the metal composite material, the SLS process solidifies a polymer binder material around steel powder (100 micron diameter) one slice at a time, forming the part. The part is then placed in a furnace, at temperatures in excess of 900 °C, where the polymer binder is burned off and the part is infiltrated with bronze to improve its density. The burn-off and infiltration procedures typically take about one day, after which secondary machining and finishing is performed. Recent improvements in accuracy and resolution, and reduction in stair-stepping, have minimized the need for secondary machining and finishing.
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